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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Component Harvesting

An obsolete, long-lead time, or high-priced device mounted on an otherwise defective or obsolete circuit assembly can be removed, refinished, and verified for re-use by the original source, saving countless costs in redesign efforts or replacement.

Micross Has Over 20 Years of Experience in Safely Harvesting Components for Board Repair & Re-Use
  • Fully automated process – No risk of bending or damaging leads.
  • Micross’ harvesting process utilizes 17 rework/reflow stations
  • Heated Stage with forced, focused hot air
  • The most precise control of temperature ramp up, time at peak and ramp down
  • Eliminates potential of thermal damage to the harvested components and circuit board

Component being desoldered from PCB

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Component Modification Services for Harvested Components
  • Robotic Hot Solder Dip (RHSD) and BGA reballing Using SAC305 for RoHS compatible or Sn63/Pb 37 for RoHS exempt applications
  • Micross has the most extensive array of next-gen equipment exceeding all process requirements of industry standards;
    • - GEIA-0006 (RHSD) and IEC TS62647-4 (Reballing) guaranteeing conformance to IPC-J-STD-001 & IPC-J-STD-002
  • Complete in-house electrical, environmental & mechanical testing

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